Modified polyamide hot melt adhesive granules and adhesive powders are polyamide hot melt adhesive resins modified by polycondensation, which are a new type of high-performance polyamide hot melt adhesives. They have good heat resistance, cold resistance, oil resistance, odorless, good flexibility, fast curing and so on, with a variety of metal and non-metallic materials have good adhesion, they are widely used in composite footwear, automotive industry, electronics industry and other markets.