Copolyamide (Co-PA) hot melt adhesive products include granules and powders of different particle sizes. It is a high-performance hot melt bonding material copolymerized from caprolactam, various dibasic acids and diamines. It has excellent adhesion, toughness, chemical resistance, high and low temperature stability, and is environmentally friendly and odorless. It is suitable for textile and clothing, shoe materials, automotive interiors, electronic and electrical fields, etc. It can bond firmly to a variety of materials. It cures quickly and is easy to process, meeting the needs of efficient and eco-friendly industrial bonding.

Copolyester (Co-PES) hot melt adhesive powder/granules is a high-performance hot melt bonding material based on ester bond polycondensation. It boasts excellent temperature resistance, adjustable melting point and viscosity, high bonding strength, as well as being eco-friendly with no volatile substances. Suitable for textile and clothing, shoe materials, automotive interiors, coatings and inks, printing and packaging, electronic industry and other fields, it can bond multiple materials. With fast curing speed, easy processing and recycling, it meets the needs of efficient and customized industrial bonding.

Modified polyamide hot melt adhesive granules and adhesive powders are polyamide hot melt adhesive resins modified by polycondensation, which are a new type of high-performance polyamide hot melt adhesives. They have good heat resistance, cold resistance, oil resistance, odorless, good flexibility, fast curing and so on, with a variety of metal and non-metallic materials have good adhesion, they are widely used in composite footwear, automotive industry, electronics industry and other markets.

TPU hot melt adhesive powder/granules is an eco-friendly high-performance bonding material based on thermoplastic polyurethane, copolymerized from different polyols and isocyanates. Its unique hard-soft segment molecular structure endows it with high elasticity and strong adhesion. It melts and flows when heated, solidifies quickly upon cooling, is solvent-free, and has ultra-low VOC emissions. Boasting a wide temperature resistance range (customizable from -40℃ to 110℃), it also offers wear and tear resistance, suitable for bonding metals, plastics, fabrics and other materials. Widely used in automotive interiors, electronics, medical consumables, clothing and footwear industries, it balances production efficiency and environmental requirements as the preferred bonding solution for intelligent manufacturing.